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Effect of Package Delamination Under 3-Points Bending Test: A Case Study Using Cyclic Loading

Abdullah S., and Abdullah M.F., and Ariffin A.K., and Baharin M.N., and Aziz Z.A., and Mod Yunoh M.H., (2008) Effect of Package Delamination Under 3-Points Bending Test: A Case Study Using Cyclic Loading. Solid State Science and Technology, 16 (2). pp. 72-82. ISSN 0128-7389

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Official URL: http://www.mass-malaysia.net/webjournal/wp-content/uploads/2008/Journal%20MASS%202008%20Jilid%202%20pdf/S.%20Abdullah%2072-82.pdf

Affiliations

Universiti Kebangsaan Malaysia. Faculty of Engineering
Universiti Kebangsaan Malaysia. Faculty of Engineering
Universiti Kebangsaan Malaysia. Faculty of Engineering
Universiti Kebangsaan Malaysia. Faculty of Engineering
Universiti Kebangsaan Malaysia. Faculty of Engineering
Universiti Kebangsaan Malaysia. Faculty of Engineering

Abstract

Generally, thermal cycle tests (TCTs) are applied to under development electronic packages in order to prove their reliability. However, a more effective test is desirable because of the TCTs are time-consuming. This paper present a mechanical cyclic test for the QFN package, namely the three-point cyclic bending test, was proposed into the subject area. This fixture test method is a test assembly that supports a specimen on two anvils or rollers, and symmetrically loads the specimen on the opposite surface with an anvil or roller using Micro Tester; a micro tensile tester incorporating a deflection measuring device shall be used to generate a controlled board deflection rate. The validity of the mechanical cyclic test method can then be verified based on the stress analysis results and also these obtain in the experiments. By considering the package delamination, lead cracking, package body cracking, and cracking between the various lead for the QFN package in the experiment, it was shown that the probability during cyclic loads and the maximum load for the QFN package for delamination can be estimated.

Item Type:Journal
Keywords:Thermal cycle tests (TCTs), electronic packages, mechanical cyclic test
Subjects:Q Science, Computer Science
ID Code:11096

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