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Effects of Parameter Match on Bondability and Reliability in Thermosonic Gold Bonding

Jalar A., and Rosle M.F., and Hamid M.A.A., (2008) Effects of Parameter Match on Bondability and Reliability in Thermosonic Gold Bonding. Solid State Science and Technology, 16 (2). pp. 180-188. ISSN 0128-7389

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Official URL: http://www.mass-malaysia.net/webjournal/wp-content/uploads/2008/Journal%20MASS%202008%20Jilid%202%20pdf/A.%20Jalar%20180-188.pdf

Affiliations

Universiti Kebangsaan Malaysia, School of Applied Physics
Universiti Kebangsaan Malaysia, School of Applied Physics
Universiti Kebangsaan Malaysia, School of Applied Physics

Abstract

Wire chemistry and bonding conditions are found to affect the Au-Al intermetallic compounds formation and growth. Bonding achieved when these two metals come into intimate contact between each other by interactions of ultrasonic energy, force, temperature and time. Inter diffusion of the joining metals at the interface activated the formation of stoichiometric intermetallic. This paper investigates the effects of bonding parameter match (ultrasonic level and force) on the growth behaviours of gold aluminide compound during thermal aging. Samples were built with different combination of ultrasonic level and force for high temperature storage (HTS) test at certain elevated temperature and time. Measurements for bonded ball mechanical strength and observations on intermetallic compounds growth patterns were carried out. Discussions on these phenomena were based on the physical, thermal and atomic properties of the bonding elements. It is suggested that un-optimised ultrasonic level and force may have effects toward poor bonding between Au and Al. Therefore, achievement of uniform intermetallic coverage is one of the factors determining the reliability of the wirebond.

Item Type:Journal
Keywords:Wire chemistry, Au-Al intermetallic, bonding parameter match, gold aluminide
Subjects:Q Science, Computer Science
ID Code:11109

[1]. S. Murali, (2006); “Formation and Growth of Intermetallics in Thermosonic Wire Bonds: Significance of Vacancy–Solute Binding Energy,” Alloys and Compounds, 426, 200-204.

[2]. J. Duan, L. Han, J. Li and J. Zhong, (2006); “Microstructural Characteristics of Au/Al Bonded,” Interfaces, China, Mechanical-Electronical Engineering College, Central South University.

[3]. J. F. Shackelford, (2000); “Introduction to materials science for engineers,” (5th ed.), New Jersey, Upper Saddle River.

[4]. C. D. Breach and F. Wulff, (2004); “New Observations on Intermetallic Compound Formation in Gold Ball Bonds: General Growth Patterns and Identification of Two Forms of Au4Al,” Microelectronics reliability , 44, 973-981.

[5]. T. D. Hund, and P. V. Plunkett, (1995); “Improving Thermosonic Gold Ball Bond Reliability,” IEEE 05669-05503.

[6]. T. Y. Tee, and X. Zhang, (2005); “Numerical and Experimental Correlation of High Temperature Reliability of Gold Wire Bonding to Intermetallics (Au/Al) Uniformity,” Thin Solid Films, 504, 355-361.

[7]. H. S. Chang, K. C. Hsieh, Teo, T. Martens, and A. Yang, (2004); “Wirebond Void Formation during High Temperature Aging, “ TCPT , 27, 155-160.

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