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Effects of Thermal Aging on Intermetallic Compounds and Voids Formation in Aual Wire Bonding

Jalar A., and Rosle M.F., and Hamid M.A.A., (2008) Effects of Thermal Aging on Intermetallic Compounds and Voids Formation in Aual Wire Bonding. Solid State Science and Technology, 16 (2). pp. 240-246. ISSN 0128-7389

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Official URL: http://www.mass-malaysia.net/webjournal/wp-content/uploads/2008/Journal%20MASS%202008%20Jilid%202%20pdf/A.%20Jalar%20240-246.pdf

Affiliations

Universiti Kebangsaan Malaysia, Faculty of Science and Technology
Universiti Kebangsaan Malaysia, Faculty of Science and Technology
Universiti Kebangsaan Malaysia, Faculty of Science and Technology

Abstract

There are several issues related to the mechanical and electrical wirebond failure during wirebonding process. Major factors are associated with AuAl intermetallic system. AuAl intermetallic compounds (IMC) can easily form at room temperature and can be accelerated with the elevated temperature. In this paper, pattern of intermetallic compounds growth and potential degradation due to voids in thermosonic ball bonding were studied on AuAl intermetallic compounds. The thermosonic ball bonding process used 99.99% gold wire and aluminized pad of Si chip. Results after HTS at 150ºC for 500 hours demonstrated that voids were generated around the diffusion layer because of the Kirkendall effect and severe voids was clearly exhibited after thermal aging at 150ºC for 1000 hours. Prolong aging time can lead to bonding failure associate with Kirkendall voids.

Item Type:Journal
Keywords:electrical wirebond failure, wirebonding process, AuAl intermetallic system
Subjects:Q Science, Computer Science
ID Code:11117

[1]. H.S. Chang, K.C. Hsieh, T. Marte s and A. Yang, (2004); Wirebond Void Formation During High Temperature Aging, TCPT, 27, 155-160.

[2]. G.G. Harman, (1997); Wire Bonding in Microelectronics, Materials, Processes, Reliability and Yield, 2nd, McGraw-Hill USA.

[3]. E. Philofsky, (1970); Intermetallic Formation in Gold-Aluminium Systems Solid state electronics, 13, 1391-1399.

[4] . M. Hansen, (1958); The Constitution of Binary Phase Diagrams, 2nd, McGraw-Hill New York.

[5]. S. Murali, N. Srikanth and C.J. Vath III, (2003); An Analysis of Intermetallis Formation of Gold and Copper Ball Bonding on Thermal Aging, Mater. Res. Bull, 38, 637-646.

[6]. K. Dittmer, S. Kumar and F. Wulff, (1999); Influence of Bonding Conditions on Degradation of Small Ball Bonds Due to Intermetallic Phase (IP) Growth, Proceeding of Intl. Conf. on High Density Pack. And MCMs, 403-408.

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