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A Planar-coil Inductively coupled Plasma System for Thin Film Deposition

Ng, K.H. and Liew, W.S. and Roslan Mohd Nor, and Wong, C.S. (2002) A Planar-coil Inductively coupled Plasma System for Thin Film Deposition. Jurnal Fizik Malaysia, 23 (1-4). pp. 51-53. ISSN 0128-0333

Full text not available from this repository.

Official URL: http://eprints.ictp.it/201/

Affiliations

University of Malaya. Dept. of Physics

Abstract

A RF planar coil inductively coupled plasma (ICP) system is set up for the purpose of thin film deposition. The system is powered by a 13.56 MHz, 550 W, 50 $\omega$ RF generator. The RF power is transferred to the plasma via a planar induction coil. The impedance matching unit consists of an air core step-down transformer and a tunable vacuum capacitor. The typical E to H mode transition distinctive to the ICP has been observed in Ar, H₂ and H₂-CH₄ admixture plasma. Plasma enhanced chemical vapor deposition (PECVD) of diamond-like carbon (DLC) film on silicon substrate is achieved using the system.

Item Type:Journal
Keywords:ICP; planar coil; RF; DLC
Subjects:Q Science, Computer Science
ID Code:988

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[2] I.M. El-Fayoumi, The electrical and electromagnet properties of low frequency inductively coupled RF plasma source, PhD Thesis, Flinders University, South Australia (1996).

[3] M.A. Lieberman and A.J. Lichtenberg, Principle of plasma discharges and material processing, Wiley 1994).

[4] Lee N.S., Han S.Y. and Oh S.G., Surface Coating and Technology, 112, 194 (1999).

[5] K.S. Harshavardhan, M.N. Vijayaraghavan, N. Chandrabhas and A.K. Sood, J. Appl. Phys., 68 (7), 3303 (1990).

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