A Planar-coil Inductively coupled Plasma System for Thin Film Deposition
Ng, K.H. and Liew, W.S. and Roslan Mohd Nor, and Wong, C.S. (2002) A Planar-coil Inductively coupled Plasma System for Thin Film Deposition. Jurnal Fizik Malaysia, 23 (1-4). pp. 51-53. ISSN 0128-0333
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Official URL: http://eprints.ictp.it/201/
University of Malaya. Dept. of Physics
A RF planar coil inductively coupled plasma (ICP) system is set up for the purpose of thin film deposition. The system is powered by a 13.56 MHz, 550 W, 50 RF generator. The RF power is transferred to the plasma via a planar induction coil. The impedance matching unit consists of an air core step-down transformer and a tunable vacuum capacitor. The typical E to H mode transition distinctive to the ICP has been observed in Ar, H₂ and H₂-CH₄ admixture plasma. Plasma enhanced chemical vapor deposition (PECVD) of diamond-like carbon (DLC) film on silicon substrate is achieved using the system.
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